Applications of lead, mercury, cadmium and hexavalent chromium which are exempted from the requirements of Article 4(1) of the RoHS Directive
   

1.

 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
   

2.

 Mercury in straight fluorescent lamps for general purposes not exceeding :
halophosphate 10 mg
triphosphate with normal lifetime 5 mg
triphosphate with long lifetime 8 mg
   

3.

 Mercury in straight fluorescent lamps for special purposes.
   
4. Mercury in other lamps not specifically mentioned in this Annex.
   
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
   
6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
   
7. Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead),
lead in solders for servers, storage and storage array systems (exemption granted until 2010),
lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication,
lead in electronic ceramic parts (e.g. piezoelectronic devices).
   
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under directive 91/338/EEC amending directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations
   
9. Hexavalent chromium as an anti-corrosion agent for carbon steel cooling systems in absorption refrigerators.
   
10. DecaBDE in polymeric applications
   
11. Lead in lead-bronze bearing shells and bushes’
   
12. Lead used in compliant pin connector systems
   
13. Lead as a coating material for the thermal conduction module c-ring
   
14. Lead and cadmium in optical and filter glass
   
15. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
   
16. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
   
At the time of writing (April 2006), in addition to the above exemptions there are some exemptions being reviewed, out to tender and further applications awaiting assessment by the European Commission. Batteries and storage batteries are not part of the RoHS Directive and are covered by their own legislation.