HDB3 - HSB3

High density brush connector HDB3/HSB3

Key features
  • Brush contact technology
  • High density contact pattern
  • Less board space
  • Shorter mated height
  • Low cost
  • High speed version (HSB3)
Applications
  • Commercial avionics & airframe
  • Military avionics & airframe
  • C4ISR
Technical information
  • 100,000 mating cycles
  • Operating Temperature of -65°C to 125°C
  • 36 unique keying combinations
  • HSB3 data rates up to 6.25 Gbp
  • 2A per signal contact
  • DWV 750 Vrms
  • 40 to 160 contacts
  • 5 sizes available
  • High density: B3 brush contact
  • Multiple contact interfaces
  • Strands of high tensile wire are bundled together to form brush-like contacts
  • By intermeshing two multi-strand wire bundles, an electrical connection is made
  • Redundant current paths 14-70 (points of contact) per mated contact with a gas tight junction

Smooth interface:

  • Low friction
  • Low mated height
  • Low mating force
  • Durability and performance of
  • Brush contacts

This connector series incorporates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors.

Resources

Catalog Board Level Products

Last update : Tue, 03/12/2019 - 11:43

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