Connectique carte à carte haute performance à coûts réduit

Caractéristiques clefs
  • 7 sizes from 3 to 5 rows, 50 to 253  signal contacts
  • 4,5A per signal contact / DWV: 750 Vrms
  • High density: 1.905 [.075] staggered grid
  • Press fit solderless attachment technology available - Lateral rails to protect male pins from external damage
  • Commercial avionics & airframe
  • Military avionics & airframe
Caractéristiques techniques
  • Cost effective rugged connector for harsh environments
  • Monolithic high density PCB interconnect
  • High pin counts up to 253 contacts per connector
  • Designed for severe mechanical envionments
  • High temperature (LCP material) & vibration levels
  • Mezzanine or right angle board to board connection

HDAS is a great alternative to hyperboloid technology. It surpasses MIL-DTL-55302 norms.

Check out our Quick Selection Guide to Board Level Products

Fichiers 3D


Brochure HDAS

Last update : lun, 04/29/2019 - 15:49

Catalog Board Level Products

Last update : mer, 05/22/2019 - 14:35

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