Connectique carte à carte haute performance à coûts réduit

Caractéristiques clefs
  • 7 sizes from 3 to 5 rows, 50 to 253  signal contacts
  • 4,5A per signal contact / DWV: 750 Vrms
  • High density: 1.905 [.075] staggered grid
  • Press fit solderless attachment technology available - Lateral rails to protect male pins from external damage
  • Commercial avionics & airframe
  • Military avionics & airframe
Caractéristiques techniques
  • Cost effective rugged connector for harsh environments
  • Monolithic high density PCB interconnect
  • High pin counts up to 253 contacts per connector
  • Designed for severe mechanical envionments
  • High temperature (LCP material) & vibration levels
  • Mezzanine or right angle board to board connection

HDAS is a great alternative to hyperboloid technology. It surpasses MIL-DTL-55302 norms.

Check out our Quick Selection Guide to Board Level Products


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Publié #PCN Produit Commentaire
05/12/17 115578 HDAS

Process modification - move to laser marking HDAS part number type SMS

Envoi des changements
05/12/17 115734 HDAS, SMASH

Supplier modification – Internalize the molding of LCP housings

Envoi des changements
14/12/17 115681 HDAS

Design modification - design update for caps

Envoi des changements
28/11/17 115620 HDAS

Design modification - rationalization of the female contacts

Envoi des changements