HDAS

High performance & competitive Board to Board connector
Product Selector & 3D files available

Key features
  • 12 sizes from 11 to 253 contacts, on 3, 4 or 5 rows
  • Hybrid configuration to mix signal, power (up to 20A) & RF
  • Right angle connection (backplane) & mezzanine configurations
  • Current rating 4,5A per signal contact / DWV: 750 Vrms
  • High density: 1.905 [.075] staggered grid
  • Large range of contacts : pc tail, press fit, surface mount & fittings options
Applications
  • Commercial avionics & airframe
  • Military avionics & airframe
  • C5ISR
Technical information
  • Cost effective rugged connector for harsh environments
  • Monolithic high density PCB interconnect
  • High pin counts up to 253 contacts per connector
  • Designed for severe mechanical envionments
  • High temperature (LCP material) & vibration levels
  • Mezzanine or right angle board to board connection
  • Reach MIL-DTL-55302 performances
  • Improved electrical security : 1.2mm
  • Screw machined contacts with gold thickness > 1µm
  • LCP glass filled insulator : operating temperature up to 150°C

HDAS is a great alternative to hyperboloid technology. It surpasses MIL-DTL-55302 norms.

Check out our Quick Selection Guide to Board Level Products

3D files

Resources

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HDAS signal contact current rating is 4.5A. 

A hybrid version for power applications with contacts up to 20A is also available

https://www.amphenol-socapex.com/

Insulator is LCP 30% glass-fiber filled. Fittings can be brass or stainless steel (303). Contacts are machined from brass alloy; female contact has a clip build with CuBe stamped and formed.

https://www.amphenol-socapex.com/

High Density Amphenol Socapex, HDAS is a 1.905mm board to board connector dedicated to harsh environments.

From 11 to 253 contacts, HDAS is ideal for severe applications when signal, power or RF is needed.

For more information on HDAS BLP connectors, click here

https://www.amphenol-socapex.com/

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