HDB3 - HSB3
High density brush connector HDB3/HSB3
Key features
- Brush contact technology
- High density contact pattern
- Less board space
- Shorter mated height
- Low cost
- High speed version (HSB3)
Applications
- Commercial avionics & airframe
- Military avionics & airframe
- C4ISR
Technical information
- 100,000 mating cycles
- Operating Temperature of -65°C to 125°C
- 36 unique keying combinations
- HSB3 data rates up to 6.25 Gbp
- 2A per signal contact
- DWV 750 Vrms
- 40 to 160 contacts
- 5 sizes available
- High density: B3 brush contact
- Multiple contact interfaces
- Strands of high tensile wire are bundled together to form brush-like contacts
- By intermeshing two multi-strand wire bundles, an electrical connection is made
- Redundant current paths 14-70 (points of contact) per mated contact with a gas tight junction
Smooth interface:
- Low friction
- Low mated height
- Low mating force
- Durability and performance of
- Brush contacts
This connector series incorporates a higher density contact pattern and lower mated height than Amphenol’s standard low mating force rectangular connectors.
Resources
Catalog Board Level Products
Last update : Wed, 02/19/2020 - 13:51
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