HDB³ - HSB³
HDB³ - HSB³
Key features
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Brush contact technology allows:
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a high number of mating cycles (100 000)
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a very low mating/unmating force (0,4 N/ contact)
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5 arrangements from 40 to 160 contacts
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Low cost connector for a high level of performance
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Board-to-wire configurations with crimped contacts
Applications
- Commercial and military aerospace
- Electronic systems
- C5ISR
- Product benefits:
100K mating/unmating cycles
Stackable connector (HDB-D4S)
Mezzanine, right angle board-to-board or board-to-cable connection
High density : 1,78 x 1,52mm [.070 x .060] staggered grid
36 keying possibilities per connector - Electrical characteristics :
2A per signal contact
750 DWV 1000 Vrms at sea level
High speed (HSB3): data rates up to 6.25 Gb/s (HSB3) - Environmental Characteristics :
100 000 mating cycles
Very low mating force (0,4 N per contact)
From -65 to 125 °C operating temperature - Materials & Platings:
Termination plating :
- 0,67μ Au over 1,27μ Ni
- 0,254μ matte Tin over 0,254μ Ni
- 0,254μ Tin lead over 0,254μ Cu
Related products
Amphenol Socapex's HDB3-HSB3 PCB connector series features brush contact technology and offers high density and high speed connectivity for a wide range of applications in commercial and military aerospace, electronic systems, and C5ISR. With a staggered grid of 1,78 x 1,52mm, these connectors provide high-density packaging and data rates up to 6,25 Gb/s (HSB3). They also offer 100 000 mating cycles, low cost, and high-performance levels.
The HDB3-HSB3 series offers mezzanine, right angle board-to-board or board-to-cables connections with 5 arrangements ranging from 40 to 160 contacts. Each connector has 36 keying possibilities, and can handle up to 2A per signal contact with a DWV of 750 Vrms. These connectors can withstand high temperature and vibration levels and have very low mating force, making them an ideal choice for demanding applications. In comparison to competitive connectors, Amphenol's HDB3-HSB3 series incorporates a higher density contact pattern and lower mated height, providing a more compact and efficient solution for high-density PCB applications.