Accessories

Thermal Clamps

Quick locking and heat dissipation for use with SIAL and SIHD series
Part Number :
SIHDG
Accessories

Thermal Clamps

Quick locking and heat dissipation for use with SIAL and SIHD series

Key features

  • Chassis devices to help dissipate components heating
  • Block daughter cards into the box slots grooves
  • Easy to use & safe in vibration
  • Low weight & space saving

Applications

  • Commercial and military aerospace
  • C5ISR
     
Technical information
  • Quick quarter-turn locking mechanism providing a faster assembly
  • Visual indication for opening or closing position
  • Heat sink thickness capability : 0.8mm to 1.6mm +- 0.15mm [.0315 to .063 +- .0059]
  • Allows a uniform pressure distribution all along the PCB edge, avoiding the damage of the heat sink and providing a better thermal conduction
  • 500 locking and unlocking cycles
Documentations
1 documents

Catalog Thermal Clamps Series SIHD GT

Catalog
Last update : 16/01/2024
Product change notifications (PCN)
1 notifications
Published
#PCN
Product
Comments
2022/08/04
#PCN 129285
Product
Thermal Clamps

Evolution of nickel plating thickness on thermal clamps

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Thermal Clamps description

Amphenol SOCAPEX Thermal Clamps provide a quick locking and efficient heat dissipation solution for use with SIAL and SIHD series connectors. These chassis devices are designed to help dissipate heating components and securely block daughter cards into the box slots grooves, while being easy to use and safe in vibration.

With a quick quarter-turn locking mechanism and visual indication for opening or closing position, these clamps are capable of providing a uniform pressure distribution all along the PCB edge, avoiding damage to the heat sink and providing better thermal conduction. These thermal clamps can accommodate heat sink thickness from 0.8mm to 1.6mm with a tolerance of +- 0.15mm [.0315 to .063 +- .0059], and can withstand up to 500 locking and unlocking cycles.

Designed for use in commercial and military aerospace and C5ISR applications, these clamps allow for efficient thermal coupling between the heat sink of the printed circuit board and the cold wall of the box or backplane, providing reliable and secure heat dissipation. They are lightweight and space-saving, making them an ideal solution for applications where weight and space are at a premium.