Thermal Clamps
Key features
- Chassis devices to help dissipate components heating
- Block daughter cards into the box slots grooves
- Easy to use & safe in vibration
- Low weight & space saving
Applications
- Commercial and military aerospace
- C5ISR
- Product features:
Quick quarter-turn locking mechanism providing a faster assembly
500 locking and unlocking cycles
Visual indication for opening or closing position - Thermal performance:
Heat sink thickness capability : 0.8mm to 1.6mm ± 0.15mm [.0315 to .063 ± .0059]
Allows a uniform pressure distribution all along the PCB edge, avoiding the damage of the heat sink and providing a better thermal conduction
With identical power, heating is 50% lower for Amphenol Thermal Clamps inserted in a water cooled rack [tested on 1/2 ATR PCB with SMT chips] - Environmental Characteristics:
From -55 to 125°C operating temperature
Related products
Thermal slides compatible with SIHD and SIAL connectors are essential chassis accessories designed to help dissipate heat from electronic components. Thanks to their quick quarter-turn locking mechanism, these slides enable faster and easier mounting of daughter boards into the enclosure slots. These thermal slides are also engineered to ensure even pressure distribution along the PCB edge, thereby preventing damage to the heat sink and ensuring better thermal conduction. Moreover, their heat sink thickness capacity of 0.8 mm to 1.6 mm ± 0.15 mm makes them compatible with a wide variety of printed circuit boards.
Thermal slides are particularly well-suited for applications in both civil and military aerospace, as well as in C5ISR systems. Their lightweight design and space-saving features make them practical accessories for environments where size and weight are critical concerns. Finally, the thermal slides are vibration-safe and provide a clear visual indication of open or closed position, allowing for quick and easy removal of daughter boards when needed. With a lifespan of 500 locking and unlocking cycles, these thermal slides are a safe and reliable choice for thermal management of printed circuit boards across a range of critical applications.