Key features
- Input/Output configuration with AWG22 crimped contacts, from size 40 to 160
- Mateable with motherboard connector
- Brush contact technology allows:
- a high number of mating cycles (100 000)
- a very low mating/unmating force (0,4 N/ contact) - Low cost connector for a high level of performance
- For more options, see our Harness-In-The-Box offer
Applications
- Commercial and military aerospace
- Electronic systems
- C6ISR
- Product benefits
100K mating/unmating cycles
High density : 1,78 x 1,52mm [.070 x .060] staggered grid
36 keying possibilities per connector - Product features
AWG 22 cable gauge - Electrical characteristics
2A per signal contact
750 DWV 1000 Vrms at sea level
High speed (HSB3): data rates up to 6.25 Gb/s (HSB3) - Environmental Characteristics
100 000 mating cycles
Very low mating force (0,4 N per contact)
From -65 to 125 °C operating temperature - Materials & Platings
Brush wire plating :
- 1,27μ Au over Ni
- 0,5μ Au over Ni
Related products
The Amphenol Socapex HDB3 crimp connector series features brush contact technology, delivering high-density, high-speed connectivity for demanding commercial and military aerospace, electronic systems, and C5ISR applications. With a staggered grid of 1.78 x 1.52 mm, these crimp connectors offer compact packaging.
Available in 5 arrangements ranging from 40 to 160 contacts, the HDB3 crimp connectors support board-to-cable connections in small spaces. Each connector provides 36 keying options and can carry up to 2A per signal contact with a dielectric withstand voltage (DWV) of 750 Vrms.
Designed to endure high temperatures and vibration, the crimp connectors ensure reliable performance with very low mating force and a long lifecycle of up to 100,000 mating cycles. Compared to competitors, the HDB3 series offers a higher contact density and lower mated height, delivering a more compact and efficient solution for high-density PCB applications.