High Performance PCB connectors


HDB³ High Density and HSB³ High Speed PCB connector
Part Number :
High Performance PCB connectors


HDB³ High Density and HSB³ High Speed PCB connector

Key features

  • Brush contact technology
  • High density : 1.80 x 1.52mm [.070 x .060] staggered grid
  • High speed : data rates up to 6.25 Gb/s (HSB³)
  • 100 000 mating cycles
  • Low cost for a high level of performance


  • Commercial and military aerospace
  • Electronic systems
  • C5ISR
Technical information
  • Mezzanine, right angle board-to-board or board-to-cables connection
  • 5 arrangements from 40 to 160 contacts
  • 36 keying possibilities per connector
  • 2A per signal contact, DWV 750 Vrms
  • High temperature & vibration levels
  • Very low mating force
2 documents

Catalog PCB Connectors

Last update : 16/01/2024

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HDB³ - HSB³ description

Amphenol Socapex's HDB³-HSB³ PCB connector series features brush contact technology and offers high density and high speed connectivity for a wide range of applications in commercial and military aerospace, electronic systems, and C5ISR. With a staggered grid of 1.80 x 1.52mm, these connectors provide high-density packaging and data rates up to 6.25 Gb/s (HSB3). They also offer 100,000 mating cycles, low cost, and high-performance levels.

The HDB³-HSB³ series offers mezzanine, right angle board-to-board or board-to-cables connections with 5 arrangements ranging from 40 to 160 contacts. Each connector has 36 keying possibilities, and can handle up to 2A per signal contact with a DWV of 750 Vrms. These connectors can withstand high temperature and vibration levels and have very low mating force, making them an ideal choice for demanding applications. In comparison to competitive connectors, Amphenol's HDB³-HSB³ series incorporates a higher density contact pattern and lower mated height, providing a more compact and efficient solution for high-density PCB applications.